6 results
Contributor affiliations
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- By Frank Andrasik, Melissa R. Andrews, Ana Inés Ansaldo, Evangelos G. Antzoulatos, Lianhua Bai, Ellen Barrett, Linamara Battistella, Nicolas Bayle, Michael S. Beattie, Peter J. Beek, Serafin Beer, Heinrich Binder, Claire Bindschaedler, Sarah Blanton, Tasia Bobish, Michael L. Boninger, Joseph F. Bonner, Chadwick B. Boulay, Vanessa S. Boyce, Anna-Katharine Brem, Jacqueline C. Bresnahan, Floor E. Buma, Mary Bartlett Bunge, John H. Byrne, Jeffrey R. Capadona, Stefano F. Cappa, Diana D. Cardenas, Leeanne M. Carey, S. Thomas Carmichael, Glauco A. P. Caurin, Pablo Celnik, Kimberly M. Christian, Stephanie Clarke, Leonardo G. Cohen, Adriana B. Conforto, Rory A. Cooper, Rosemarie Cooper, Steven C. Cramer, Armin Curt, Mark D’Esposito, Matthew B. Dalva, Gavriel David, Brandon Delia, Wenbin Deng, Volker Dietz, Bruce H. Dobkin, Marco Domeniconi, Edith Durand, Tracey Vause Earland, Georg Ebersbach, Jonathan J. Evans, James W. Fawcett, Uri Feintuch, Toby A. Ferguson, Marie T. Filbin, Diasinou Fioravante, Itzhak Fischer, Agnes Floel, Herta Flor, Karim Fouad, Richard S. J. Frackowiak, Peter H. Gorman, Thomas W. Gould, Jean-Michel Gracies, Amparo Gutierrez, Kurt Haas, C.D. Hall, Hans-Peter Hartung, Zhigang He, Jordan Hecker, Susan J. Herdman, Seth Herman, Leigh R. Hochberg, Ahmet Höke, Fay B. Horak, Jared C. Horvath, Richard L. Huganir, Friedhelm C. Hummel, Beata Jarosiewicz, Frances E. Jensen, Michael Jöbges, Larry M. Jordan, Jon H. Kaas, Andres M. Kanner, Noomi Katz, Matthew S. Kayser, Annmarie Kelleher, Gerd Kempermann, Timothy E. Kennedy, Jürg Kesselring, Fary Khan, Rachel Kizony, Jeffery D. Kocsis, Boudewijn J. Kollen, Hubertus Köller, John W. Krakauer, Hermano I. Krebs, Gert Kwakkel, Bradley Lang, Catherine E. Lang, Helmar C. Lehmann, Angelo C. Lepore, Glenn S. Le Prell, Mindy F. Levin, Joel M. Levine, David A. Low, Marilyn MacKay-Lyons, Jeffrey D. Macklis, Margaret Mak, Francine Malouin, William C. Mann, Paul D. Marasco, Christopher J. Mathias, Laura McClure, Jan Mehrholz, Lorne M. Mendell, Robert H. Miller, Carol Milligan, Beth Mineo, Simon W. Moore, Jennifer Morgan, Charbel E-H. Moussa, Martin Munz, Randolph J. Nudo, Joseph J. Pancrazio, Theresa Pape, Alvaro Pascual-Leone, Kristin M. Pearson-Fuhrhop, P. Hunter Peckham, Tamara L. Pelleshi, Catherine Verrier Piersol, Thomas Platz, Marcus Pohl, Dejan B. Popović, Andrew M. Poulos, Maulik Purohit, Hui-Xin Qi, Debbie Rand, Mahendra S. Rao, Josef P. Rauschecker, Aimee Reiss, Carol L. Richards, Keith M. Robinson, Melvyn Roerdink, John C. Rosenbek, Serge Rossignol, Edward S. Ruthazer, Arash Sahraie, Krishnankutty Sathian, Marc H. Schieber, Brian J. Schmidt, Michael E. Selzer, Mijail D. Serruya, Himanshu Sharma, Michael Shifman, Jerry Silver, Thomas Sinkjær, George M. Smith, Young-Jin Son, Tim Spencer, John D. Steeves, Oswald Steward, Sheela Stuart, Austin J. Sumner, Chin Lik Tan, Robert W. Teasell, Gareth Thomas, Aiko K. Thompson, Richard F. Thompson, Wesley J. Thompson, Erika Timar, Ceri T. Trevethan, Christopher Trimby, Gary R. Turner, Mark H. Tuszynski, Erna A. van Niekerk, Ricardo Viana, Difei Wang, Anthony B. Ward, Nick S. Ward, Stephen G. Waxman, Patrice L. Weiss, Jörg Wissel, Steven L. Wolf, Jonathan R. Wolpaw, Sharon Wood-Dauphinee, Ross D. Zafonte, Binhai Zheng, Richard D. Zorowitz
- Edited by Michael Selzer, Stephanie Clarke, Leonardo Cohen, Gert Kwakkel, Robert Miller, Case Western Reserve University, Ohio
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- Book:
- Textbook of Neural Repair and Rehabilitation
- Published online:
- 05 May 2014
- Print publication:
- 24 April 2014, pp ix-xvi
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Contributor affiliations
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- By Frank Andrasik, Melissa R. Andrews, Ana Inés Ansaldo, Evangelos G. Antzoulatos, Lianhua Bai, Ellen Barrett, Linamara Battistella, Nicolas Bayle, Michael S. Beattie, Peter J. Beek, Serafin Beer, Heinrich Binder, Claire Bindschaedler, Sarah Blanton, Tasia Bobish, Michael L. Boninger, Joseph F. Bonner, Chadwick B. Boulay, Vanessa S. Boyce, Anna-Katharine Brem, Jacqueline C. Bresnahan, Floor E. Buma, Mary Bartlett Bunge, John H. Byrne, Jeffrey R. Capadona, Stefano F. Cappa, Diana D. Cardenas, Leeanne M. Carey, S. Thomas Carmichael, Glauco A. P. Caurin, Pablo Celnik, Kimberly M. Christian, Stephanie Clarke, Leonardo G. Cohen, Adriana B. Conforto, Rory A. Cooper, Rosemarie Cooper, Steven C. Cramer, Armin Curt, Mark D’Esposito, Matthew B. Dalva, Gavriel David, Brandon Delia, Wenbin Deng, Volker Dietz, Bruce H. Dobkin, Marco Domeniconi, Edith Durand, Tracey Vause Earland, Georg Ebersbach, Jonathan J. Evans, James W. Fawcett, Uri Feintuch, Toby A. Ferguson, Marie T. Filbin, Diasinou Fioravante, Itzhak Fischer, Agnes Floel, Herta Flor, Karim Fouad, Richard S. J. Frackowiak, Peter H. Gorman, Thomas W. Gould, Jean-Michel Gracies, Amparo Gutierrez, Kurt Haas, C.D. Hall, Hans-Peter Hartung, Zhigang He, Jordan Hecker, Susan J. Herdman, Seth Herman, Leigh R. Hochberg, Ahmet Höke, Fay B. Horak, Jared C. Horvath, Richard L. Huganir, Friedhelm C. Hummel, Beata Jarosiewicz, Frances E. Jensen, Michael Jöbges, Larry M. Jordan, Jon H. Kaas, Andres M. Kanner, Noomi Katz, Matthew S. Kayser, Annmarie Kelleher, Gerd Kempermann, Timothy E. Kennedy, Jürg Kesselring, Fary Khan, Rachel Kizony, Jeffery D. Kocsis, Boudewijn J. Kollen, Hubertus Köller, John W. Krakauer, Hermano I. Krebs, Gert Kwakkel, Bradley Lang, Catherine E. Lang, Helmar C. Lehmann, Angelo C. Lepore, Glenn S. Le Prell, Mindy F. Levin, Joel M. Levine, David A. Low, Marilyn MacKay-Lyons, Jeffrey D. Macklis, Margaret Mak, Francine Malouin, William C. Mann, Paul D. Marasco, Christopher J. Mathias, Laura McClure, Jan Mehrholz, Lorne M. Mendell, Robert H. Miller, Carol Milligan, Beth Mineo, Simon W. Moore, Jennifer Morgan, Charbel E-H. Moussa, Martin Munz, Randolph J. Nudo, Joseph J. Pancrazio, Theresa Pape, Alvaro Pascual-Leone, Kristin M. Pearson-Fuhrhop, P. Hunter Peckham, Tamara L. Pelleshi, Catherine Verrier Piersol, Thomas Platz, Marcus Pohl, Dejan B. Popović, Andrew M. Poulos, Maulik Purohit, Hui-Xin Qi, Debbie Rand, Mahendra S. Rao, Josef P. Rauschecker, Aimee Reiss, Carol L. Richards, Keith M. Robinson, Melvyn Roerdink, John C. Rosenbek, Serge Rossignol, Edward S. Ruthazer, Arash Sahraie, Krishnankutty Sathian, Marc H. Schieber, Brian J. Schmidt, Michael E. Selzer, Mijail D. Serruya, Himanshu Sharma, Michael Shifman, Jerry Silver, Thomas Sinkjær, George M. Smith, Young-Jin Son, Tim Spencer, John D. Steeves, Oswald Steward, Sheela Stuart, Austin J. Sumner, Chin Lik Tan, Robert W. Teasell, Gareth Thomas, Aiko K. Thompson, Richard F. Thompson, Wesley J. Thompson, Erika Timar, Ceri T. Trevethan, Christopher Trimby, Gary R. Turner, Mark H. Tuszynski, Erna A. van Niekerk, Ricardo Viana, Difei Wang, Anthony B. Ward, Nick S. Ward, Stephen G. Waxman, Patrice L. Weiss, Jörg Wissel, Steven L. Wolf, Jonathan R. Wolpaw, Sharon Wood-Dauphinee, Ross D. Zafonte, Binhai Zheng, Richard D. Zorowitz
- Edited by Michael E. Selzer, Stephanie Clarke, Leonardo G. Cohen, Gert Kwakkel, Robert H. Miller, Case Western Reserve University, Ohio
-
- Book:
- Textbook of Neural Repair and Rehabilitation
- Published online:
- 05 June 2014
- Print publication:
- 24 April 2014, pp ix-xvi
-
- Chapter
- Export citation
3D Process Integration – Requirements and Challenges
- Juergen Max Wolf, Armin Klumpp, Kai Zoschke, Robert Wieland, Lars Nebrich, Matthias Klein, Hermann Oppermann, Peter Ramm, Oswin Ehrmann, Herbert Reichl
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1112 / 2008
- Published online by Cambridge University Press:
- 01 February 2011, 1112-E01-01
- Print publication:
- 2008
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Heterogeneous system integration is one of the key topics for future system integration. Scaling of System on Chip (SoC) alone does not address today's requirements of smart electronic systems in terms of performance, functionality, miniaturization, low production cost and time to market. The traditional microelectronic packaging will more and more convert into complex sys-tem integration. ‘More than Moore’ will be required due to tighter integration of system level components at the package level. This trend leads to advanced System in Package solutions (SiP) which require the synergy and a combination of wafer level and board integration technologies and which are rapidly evolving from a specialty technology used in a narrow set of applications to a high volume technology with wide ranging impact on electronics markets especially due to the high volume and very cost competitive consumer and communication market. Advanced SiP approaches explore the third dimension which results in complex system architectures that also require, beside new technologies and improved materials, adequate system design tools and reli-ability models. One of the most promising technology approaches is 3D packaging which in-volves a set of different integration approaches including stacked packages, silicon interposer with Through Silicon Vias (TSV) and embedding technologies. The paper highlights future sys-tem and potential technical solutions.
Experimental studies on Lecanora rupicola (L.) Zahlbr.: chemical and microscopical investigations of the mycobiont and re-synthesis stages
- Georg BRUNAUER, Armin HAGER, Wolf Dietrich KRAUTGARTNER, Roman TÜRK, Elfie STOCKER-WÖRGÖTTER
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- Journal:
- The Lichenologist / Volume 38 / Issue 6 / November 2006
- Published online by Cambridge University Press:
- 19 October 2006, pp. 577-585
- Print publication:
- November 2006
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Culture experiments that trigger the axenically grown mycobionts of Lecanora rupicola to produce the polyketide chemosyndrome typical of the naturally grown lichen are reported. This chemosyndrome comprises lecanoric, haematommic and orsellinic acids, sordidone, eugenitol and atranorin, all of which were hardly produced under standard culture conditions. The only exception was arthothelin that was only present in the voucher specimen. It has been shown that almost the complete acetyl-polymalonyl-pathway leading to depsides and chromones can be induced in culture, but apparently not the xanthones. The mycobiont was also successfully re-synthesized with its original photobiont, as confirmed by Scanning Electron Microscope studies (SEM). Cultures of the resynthesised lichen biosynthesized additional satellite substances, which were not detected either in the voucher specimens or in the aposymbiontically (without the photobiont) grown mycobiont cultures. The identity of cultured mycobionts of L. rupicola was confirmed by comparing ITS-DNA-sequence data from the original lichen with publicly available (GeneBank) sequences of that species.
Intelligent search strategies based on adaptive Constraint Handling Rules
- ARMIN WOLF
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- Journal:
- Theory and Practice of Logic Programming / Volume 5 / Issue 4-5 / July 2005
- Published online by Cambridge University Press:
- 01 July 2005, pp. 567-594
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The most advanced implementation of adaptive constraint processing with Constraint Handling Rules (CHR) allows the application of intelligent search strategies to solve Constraint Satisfaction Problems (CSP). This presentation compares an improved version of conflict-directed backjumping and two variants of dynamic backtracking with respect to chronological backtracking on some of the AIM instances which are a benchmark set of random 3-SAT problems. A CHR implementation of a Boolean constraint solver combined with these different search strategies in Java is thus being compared with a CHR implementation of the same Boolean constraint solver combined with chronological backtracking in SICStus Prolog. This comparison shows that the addition of “intelligence” to the search process may reduce the number of search steps dramatically. Furthermore, the runtime of their Java implementations is in most cases faster than the implementations of chronological backtracking. More specifically, conflict-directed backjumping is even faster than the SICStus Prolog implementation of chronological backtracking, although our Java implementation of CHR lacks the optimisations made in the SICStus Prolog system.
3D System Integration Technologies
- Peter Ramm, Armin Klumpp, Reinhard Merkel, Josef Weber, Robert Wieland, Andreas Ostmann, Jürgen Wolf
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- Journal:
- MRS Online Proceedings Library Archive / Volume 766 / 2003
- Published online by Cambridge University Press:
- 01 February 2011, E5.6
- Print publication:
- 2003
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In the last years strong efforts were made to miniaturize microelectronic systems. Chip scale packages, flip chips and multichip modules are now commonly used in a great variety of products (e. g. mobile phones, hand-held computers and chip cards). Future microelectronic applications require significantly more complex devices with increased functionality and performance. Due to added device content, chip area will also increase. Performance, multi-functionality and reliability of microelectronic systems will be limited mainly by the wiring between the subsystems (so called “wiring crisis”), causing a critical performance bottleneck for future IC generations. 3D System Integration provides a base to overcome these drawbacks. Furthermore, systems with minimum volume and weight as well as reduced power consumption can be realized for portable applications. 3D integrated systems show reduced chip areas and enable optimized partitioning, both which decrease the fabrication cost of the system. An additional benefit is the enabling of minimal interconnection lengths and the elimination of speed-limiting inter-chip interconnects. 3D concepts which take advantage of wafer level processing to avoid increasing package sizes and expensive single component assembling processes have the potential to integrate passive devices resistors, inductors and capacitors into the manufacturing system and provide full advantage for system performance.
The ITRS roadmap predicts an increasing demand for systems-on-a-chip (SoC) [1]. Conventional fabrication is based on embedded technologies which are cost intensive. A new low cost fabrication approach for vertical system integration is introduced. The wafer-level 3D SoC technology, optimized to the capability for chip-to-wafer stacking has the potential to replace embedded technologies based on monolithic integration.